Additive Processes[edit | edit source]
Processes where material is added to the wafer.
Overview[edit | edit source]
Oxidation[edit | edit source]
Oxidation in microtechnology refers most often to the oxidation of silicon. A layer of silicon dioxide created on the surface of a silicon wafer can be easily patterned. An SiO2 layer can be created by thermal oxidation or by deposition.
Chemical Vapor Deposition (CVD)[edit | edit source]
Physical Vapor Deposition (PVD)[edit | edit source]
Sputter Deposition[edit | edit source]
Electron Beam Evaporation Coating[edit | edit source]
Epitaxial Growth[edit | edit source]
- Metal Organic Vapor Phase Epitaxy (MOVPE)
- Molecular beam epitaxy (MBE) using solid sources and Chemical beam epitaxy (CBE) using gasseuos sources.
- Epitaxy in general.
- Atomic layer epitaxy where only a few monolayers are deposited and bond to chemisorption sites on the surface.
Electrochemical Methods[edit | edit source]
Electroplating[edit | edit source]
Electroless depositions[edit | edit source]
- Electroless nickel plating
- Electrochemical deposition of metals onto silicon
- Y. Okinaka, in Electroless Plating: Fundamentals and Applications, edited by Glenn O. Mallory and Juan B. Hajdu, Chapter 15, American Electroplaters and Surface Finishers Society (1990).
Spinning[edit | edit source]
Photo and electron beam resists as well as many other polymers are often coated on wafers by spinning a volatile solution of the compound onto the wafer.
Surface Functionalization[edit | edit source]
References[edit | edit source]
See also notes on editing this book about how to add references Microtechnology/About#How to Contribute.