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Microtechnology/Additional Methods

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Additional Methods

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Apart from additiev and etching processes, there is also a range of processes to alter the materials properties and to characterize them.

Rapid Thermal Anneal (RTA)

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Wafer Bonding

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Wafer bonding

Wafer bond characterization

Electrical Connections

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Doping

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Ion Implantation

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Diffusion Doping

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Spin-on doping

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Packaging

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Interconnections

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Encapsulation

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  • Silicone oil
  • Spray-on polymers
Glues
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  • Epo-tek H77 is a common packaging two-component UHV compatible epoxy glue.
  • Fortafix makes a high temperature glue that should work up to around 1000 C called Rocksett.
  • Vitcas Refractories manufacturer of high temperature glue/adhesives for industrial and domestic use up to 1700 C

Ellipsometry

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Ellipsometers are used to measure thin film thicknesses by their optical properties (refractive index and reflectivity/absorbance).

4 Point Measurements

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The four-point probe technique can be used to measure the conductivity of thin films. For improved measurements micro four-point probes can be used. Capres has an application note about micro four-point probes.

Atomic Force Microscopy

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The Atomic force microscope (AFM) is mainly used to measure the topography of a surface, such as the roughness.

Scanning Electron Microscopy

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JEOL has a good guide to SEM image interpretation

Optical Microscopy

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Theres a good introduction to optical microscopy from Zeiss.

Vacuum Equipment

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References

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See also notes on editing this book about how to add references Microtechnology/About#How to Contribute.