Microtechnology/Additional Methods

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Additional Methods[edit | edit source]

Apart from additiev and etching processes, there is also a range of processes to alter the materials properties and to characterize them.

Rapid Thermal Anneal (RTA)[edit | edit source]

Wafer Bonding[edit | edit source]

Wafer bonding

Wafer bond characterization

Electrical Connections[edit | edit source]

Doping[edit | edit source]

Ion Implantation[edit | edit source]

Diffusion Doping[edit | edit source]

Spin-on doping[edit | edit source]

Packaging[edit | edit source]

Interconnections[edit | edit source]

Encapsulation[edit | edit source]

  • Silicone oil
  • Spray-on polymers
Glues[edit | edit source]
  • Epo-tek H77 is a common packaging two-component UHV compatible epoxy glue.
  • Fortafix makes a high temperature glue that should work up to around 1000 C called Rocksett.
  • Vitcas Refractories manufacturer of high temperature glue/adhesives for industrial and domestic use up to 1700 C

Ellipsometry[edit | edit source]

Ellipsometers are used to measure thin film thicknesses by their optical properties (refractive index and reflectivity/absorbance).

4 Point Measurements[edit | edit source]

The four-point probe technique can be used to measure the conductivity of thin films. For improved measurements micro four-point probes can be used. Capres has an application note about micro four-point probes.

Atomic Force Microscopy[edit | edit source]

The Atomic force microscope (AFM) is mainly used to measure the topography of a surface, such as the roughness.

Scanning Electron Microscopy[edit | edit source]

JEOL has a good guide to SEM image interpretation

Optical Microscopy[edit | edit source]

Theres a good introduction to optical microscopy from Zeiss.

Vacuum Equipment[edit | edit source]

References[edit | edit source]

See also notes on editing this book about how to add references Microtechnology/About#How to Contribute.