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English: Thermal resistance and heat transfer coefficient plotted against flow rate for the specific heat sink design used by Jeggels, et. al. (Jeggels, Y.U., Dobson, R.T., Jeggels, D.H., Comparison of the cooling performance between heat pipe and aluminium conductors for electronic equipment enclosures, Proceedings of the 14th International Heat Pipe Conference, Florianópolis, Brazil, 2007.) The data was generated using the equations provided in the article. The data shows that for an increasing air flow rate, the thermal resistance of the heat sink decreases.
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Author Dtc5341

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26 January 2010

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current09:45, 26 January 2010Thumbnail for version as of 09:45, 26 January 2010911 × 623 (10 KB)Dtc5341{{Information |Description={{en|1=Thermal resistance and heat transfer coefficient plotted against flow rate for the specific heat sink design used by Jeggels, et. al. (Jeggels, Y.U., Dobson, R.T., Jeggels, D.H., Comparison of the cooling performance betw

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