Microtechnology/Additional Methods

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[edit] Additional Methods

Apart from additiev and etching processes, there is also a range of processes to alter the materials properties and to characterize them.

[edit] Rapid Thermal Anneal (RTA)

[edit] Wafer Bonding

[edit] Electrical Connections

[edit] Doping

[edit] Ion Implantation

[edit] Diffusion Doping

[edit] Spin-on doping

[edit] Packaging

[edit] Interconnections

[edit] Encapsulation

  • Silicone oil
  • Spray-on polymers

[edit] Glues

  • Epo-tek H77 is a common packaging two-component UHV compatible epoxy glue.
  • Fortafix makes a high temperature glue that should work up to around 1000 C called Rocksett.
  • Vitcas Refractories manufacturer of high temperature glue/adhesives for industrial and domestic use up to 1700 C

[edit] Ellipsometry

Ellipsometers are used to measure thin film thicknesses by their optical properties (refractive index and reflectivity/absorbance).

[edit] 4 Point Measurements

The four-point probe technique can be used to measure the conductivity of thin films. For improved measurements micro four-point probes can be used. Capres has an application note about micro four-point probes.

[edit] Atomic Force Microscopy

The Atomic force microscope (AFM) is mainly used to measure the topography of a surface, such as the roughness.

[edit] Scanning Electron Microscopy

JEOL has a good guide to SEM image interpretation

[edit] Optical Microscopy

Theres a good introduction to optical microscopy from Zeiss.

[edit] Vacuum Equipment

[edit] References

See also notes on editing this book about how to add references Microtechnology/About#How to Contribute.