Microtechnology/Additional Methods
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[edit] Additional Methods
Apart from additiev and etching processes, there is also a range of processes to alter the materials properties and to characterize them.
[edit] Rapid Thermal Anneal (RTA)
[edit] Wafer Bonding
[edit] Electrical Connections
[edit] Doping
[edit] Ion Implantation
[edit] Diffusion Doping
[edit] Spin-on doping
[edit] Packaging
[edit] Interconnections
- Wire bonding
- Flip chip bonding
- Wedge bonding
- Using ZIF sockets
[edit] Encapsulation
- Silicone oil
- Spray-on polymers
[edit] Glues
- Epo-tek H77 is a common packaging two-component UHV compatible epoxy glue.
- Fortafix makes a high temperature glue that should work up to around 1000 C called Rocksett.
- Vitcas Refractories manufacturer of high temperature glue/adhesives for industrial and domestic use up to 1700 C
[edit] Ellipsometry
Ellipsometers are used to measure thin film thicknesses by their optical properties (refractive index and reflectivity/absorbance).
[edit] 4 Point Measurements
The four-point probe technique can be used to measure the conductivity of thin films. For improved measurements micro four-point probes can be used. Capres has an application note about micro four-point probes.
[edit] Atomic Force Microscopy
The Atomic force microscope (AFM) is mainly used to measure the topography of a surface, such as the roughness.
[edit] Scanning Electron Microscopy
JEOL has a good guide to SEM image interpretation
[edit] Optical Microscopy
Theres a good introduction to optical microscopy from Zeiss.
[edit] Vacuum Equipment
- mass flow controllers (MFC) Gas conversion factors and formulas for calculating them
[edit] References
See also notes on editing this book about how to add references Microtechnology/About#How to Contribute.